Meta and University Scientists Unveil New Microchip Material
Researchers have created a new material similar to dental fillings that may help reduce electronic waste.
Global e-waste production reached 62 million metric tons in 2022, with projections increasing to 82 million metric tons by 2030.
The UN Institute for Training and Research estimates that only 20% of e-waste will be recycled by 2030.
A new material for electronic substrates, developed by researchers from the University of Utah, MIT, and Meta's Reality Labs, could address e-waste issues.
This innovative material is flexible, easily dissolvable, and could enhance the recyclability of electronic components.
Thomas Wallin, an MIT professor, suggests this material could lead to high-performance flexible electronics and better e-waste management.
Kapton, a commonly used flexible substrate, is not easily dissolvable, which hinders its recycling and reuse.
The new material, similar to dental filling polymers, is processed at low temperatures and hardened with UV light.
It is expected to integrate well with current manufacturing processes and support more complex electronic designs.
The material’s ability to dissolve under mild conditions allows for the recovery of valuable metals from old electronics.